Wire drawing processing technology
For semiconductor substrate leads and measuring instruments! Wire drawing and rolling processing, clad lamination processing.
At Nikko, we specialize in wire drawing and rolling processing, as well as clad lamination processing. After plating treatment, wire drawing and rolling processing can maintain uniform coating properties due to the fiber crystallization of the plated surface layer. Our products are widely used for free alignment connectors, semiconductor substrate leads, diode leads, measurement instruments, and various sensors. 【Features】 ■ Wire drawing and rolling processing, as well as clad lamination processing ■ Widely utilized for measurement instruments and various sensors *For more details, please refer to the PDF materials or feel free to contact us.
- 企業：ニッコーシ
- 価格：Other
